Symposium 4: Think Outside the Chip: MEMS-Based System Solutions

Moderator |  Roger Grace  | President | Roger Grace Associates
7 Jun, 2010 | 9:00 am - 5:00 pm

This all-day symposium addresses, from a global perspective, current and future applications and major issues associated with the creation of a MEMS-based system and its design and manufacturing/testing. The focus is on the system elements which compliment the MEMS sensor/actuator e.g. signal conditioning circuits, microcontrollers, embedded intelligence/software algorithms, networking circuits and their interaction with the MEMS device. System element connectivity and device/system packaging is addressed. The symposium begins with an overview of market and technology trends and the technology infrastructure to support the systems approach. World-renowned researchers from national laboratories and academia review some of their more significant current activities that are expected to form the basis of many innovative products scheduled for near-term commercialization. Technical staffers from major manufacturers and exciting new startups present information on their technology approaches to systems solutions for current and future applications. A panel discussion concludes the event.

Symposium Participants and Topics include:

9:00 - 9:10 AM Welcome and Introduction
R. Grace, Roger Grace Associates
9:10 - 9:40 AM Examples of Smart Systems Solutions: From Monitoring Systems to Micro Analysis Systems (KEYNOTE)
T. Gessner, Fraunhofer Research Institution for Electronic Nano Systems (GERMANY)
9:40 - 10:00 AM Think Outside the Chip: MEMS-Based Systems Solutions…Review and Overview
R. Grace, Roger Grace Associates (US)
10:00 - 10:20 AM Integrated System Solutions with MEMS Sensors
J. Esfandyari, ST Microelectronics (ITALY)
10:20 - 10:35 AM Break
10:35 - 10:55 AM CMOS Heterogeneous Integration Strategies for MEMS
F. Pessolano, R. Borzi, A. Witvrouw; IMEC (BELGIUM)
10:55 - 11:15 AM Interfacing to Sensors with Mixed Signal Via- Configurable Arrays
J. Kemerling, Triad Semiconductor (US)
11:15 - 11:35 AM Design Issues and Tradeoffs of Electronic Interfaces of MEMS Sensors
A. Hafez, A. Elsayed; Si-Ware Systems (EGYPT)
11:35 - 11:55 AM Overcoming the Challenges of Using Inertial and Magnetic Sensors in Sports / Fitness Applications
T. Kelliher, Movea (US)
11:55 - 12:55 PM Lunch
12:55 - 1:00 PM Welcome and Introduction
R. Grace, Roger Grace Associates
1:00 - 1:30 PM Thinking Outside the Chip: The European Platform of Smart Systems (EPoSS) (KEYNOTE)
G. Meyer, VDI/VDE (Germany) 
1:30 - 2:00 PM Applying New MEMS Architecture to Achieve Low-Cost, Ultra-Sensitive Wireless Sensors for Mission Critical Applications (KEYNOTE)
P. Hartwell, HP Laboratories (US)
2:00 - 2:20 PM MEMS Inertial Sensor Systems for Mass Market Applications
C. Lucien, Hillcrest Laboratories (US)
2:20 - 2:40 PM Co-Design of MEMS, Electronics and Packaging: Time to Market Enabler
M. Maher, S. Cases; SoftMEMS (US)
2:40 - 3:00 PM Blending MEMS into IC Design Flows
J. van Kuijk, M. Kamon; Coventor (US)
3:00 - 3:15 PM Break
3:15 - 3:30 PM Wafer Bonding and the Integration of MEMS into 3D Devices
E. Pabo, EV Group (US)
3:30 - 3:50 PM Integration Approach of MEMS 3- Axis Gyro Cluster Provides Alternative to FOG
S. Habibi, R. Holm, S. Normann, F. Pettersen, T. Kvisteroy; Sensonor Technologies (NORWAY)
3:50 - 4:10 PM Testing of Membrane-type MEMS Devices on Wafer Level by Using Wafer-Probers
S. Giessmann, F.M. Werner, Cascade Microtech/MEMUNITY (GERMANY)
4:10 - 5:00 PM

Panel Discussion: Integration Tradeoffs for a Design for Manufacturing World
Panel Moderator: R. Grace, Roger Grace Associates
Panelists: K. Lightman, MIG
J. Brown, MEMS Exchange
J. Giachino, University of Michigan
H. Stephanou, The University of Texas at Arlington
Dr. J. Knutti, Acuity Incorporated